Manufacturing News

TSMC turns on the “volume” for its 28nm process

Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its 28nm process is in volume production and production wafers have been shipped to customers.

TSMC leads the foundry segment to achieve volume production at 28nm node.

The company’s 28nm manufacturing process includes 28nm High Performance (28HP), 28nm High Performance Low Power (28HPL), 28nm Low Power (28LP), and 28nm High Performance Mobile Computing (28HPM).

The 28HP, 28HPL and 28LP are currently in volume production, while the High Performance Mobile Computing 28HPM will be ready for production by the end of this year, the company said in a statement released yesterday.

According to the statement, the production-version design collateral of 28HPM has been distributed to most mobile computing customers for their product-design use.

The company reports the number of customer 28nm production tape outs has more than doubled as compared with that of 40nm due to closer engagement and collaboration with customer.

 At 28nm, there are currently more than 80 customer product tape-outs.

TSMC’s 28nm design ecosystem is available through its Open Innovation Platform with qualified EDA design tools and third-party IP ready for customer designs. 

 

TSMC’s 28nm technology

28nm is a method of manufacturing for the foundry industry which uses high-K metal gate (HKMG) process. Poly/oxynitride process is also offered to meet customer’s time-to-market need.

According to the company, the 28nm technology delivers twice the gate density of the 40nm process and also features an SRAM cell size shrink of 50%.

The low power (LP) process is the first available 28nm technology. It is reportedly ideal for low standby power applications such as cellular baseband. The 28LP process boasts a 20% speed improved over the 40LP process at the same leakage/gate.

The 28nm high performance (HP) process is the first option to use high-k metal gate process technology. Featuring superior speed and performance, the 28HP process targets CPU, GPU, FPGA, PC, networking, and consumer electronics applications. The 28HP process supports a 45 percent speed improvement over the 40G process at the same leakage/gate.

The 28nm low power with high-k metal gates (HPL) technology adopts the same gate stack as HP technology while meeting more stringent low leakage requirements with a trade of performance speed. With a wide leakage and performance spectrum, N28HPL is best suitable for cellular baseband, application process, wireless connectivity, and programmable logics. The 28HPL process reduces both standby and operation power by more than 40%.

TSMC also provides high performance for mobile applications (HPM) technology to address the need for applications requiring high speed as well as low leakage power. Such technology can provide better speed than 28HP and similar leakage power as 28LP. With such wide performance/leakage coverage, 28HPM is also ideal for many applications from networking, tablet, to mobile consumer products.

The 28nm family will also provide a wider variety of metal options to support a broad range of product applications for better trade-off between performance and density.

Information on TSMC’s 28nm technology was sourced from the company’s website.

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