Nordson EFD has announced a new SolderPlus dispensing paste formula to improve bond reliability in RFID (Radio Frequency Identification) tags, dual interface (DI) smart cards, and biometric passports. These applications require attaching an antenna electrically connected to a chip. Manufacturers often use a silver filled epoxy to bond these components. This method requires a curing process, which can … Continue reading Solution to improve bond reliability in RFID tags
RFID technology isn’t new. In fact, the concept has been around since World War II and more recently used in airports, retail, and meat and livestock industries.
Much has been written about Industry 4.0 being the next industrial revolution, but how many Australian manufacturers really understand the concept?
Kollakorn has announced that its RFID (radio frequency identification) asset management technology will be trialled at a demo installation in Haworth’s Sydney showroom.