STMICROELECTRONICS is the world’s first MEMS manufacturer to have implemented Through-Silicon Via technology for high volume production.
TSV replaces traditional wiring with short vertical interconnects in STMicroelectronic’s multi-chip Micro-Electro-Mechanical Systems (MEMS) devices. These include smart sensors and multi-axis inertial modules, and result in better functional integration and performance in a smaller form factor.
TSV utilizes short, vertical structures to connect multiple silicon dice stacked vertically in a single package, offering greater space efficiency and higher interconnect density compared with wire bonding or flip chip stacking.
According to STMicroelectronics, the company is aiming to make MEMS ubiquitous in all facets of life. High-performance 3D-chip integration in ST’s smart sensors and multi-axis inertial modules is another step towards that goal.