The Australian Packaging Machinery Association, in conjunction with the Australian Institute of Packaging, is pleased to announce that submissions are open for the second annual scholarship program. This program allows a packaging engineer the opportunity to complete a Diploma in Packaging Technology.
The Australian Packaging Machinery Association – Australia’s national organisation, representing the packaging and processing machinery industry – believes that the scholarship program is not only an opportunity for a packaging engineer to further their education in the field of packaging, but also allows associations like theirs to contribute to the industry.
“The annual scholarship enables the awardee to enrol in the Australian Institute of Packaging Diploma in Packaging Technology – an internationally recognised and accredited course,” said Rob Lawrence, Chairman of the Australian Packaging Machinery Association.
“The Australian Packaging Machinery Association annual scholarship program is now in its second year and the AIP encourages all packaging engineers to register for the 2010 scholarship,” said Craig Wellman MAIP, National President of the AIP.
The Diploma in Packaging Technology has been offered by the AIP continuously since 1980 and is now offered on-line. The qualification is broad, and provides an opportunity to study the principles of packaging, packaging materials and packaging processes. The Diploma is a degree-level qualification that prepares students to take responsibility for packaging operations at any level through the supply chain.
Entries are now available for the Australian Packaging Machinery Association 2010 Scholarship program and can be accessed by emailing firstname.lastname@example.org or visiting www.aipack.com.au and clicking on the scholarship page.
Submissions must be received by Close of Business on Friday the 30th of April with the 2010 winner being announced at the AIP National Conference which will be held on the 16th and 17th of June at the Melbourne Cricket Ground, Victoria.