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New report forecasts semiconductor future in additive manufacturing

A new market study outlines the potential for additive manufacturing (AM) technologies to optimise the capabilities of the semiconductor industry.  

The research report titled ‘3D Printing for Semiconductors: Market Opportunity Brief’ is from Additive Manufacturing Research (AM Research).

The market study outlines specific benefits the semiconductor value chain provides to AM, including reduced lead times, reduced parts, and thermal management, packaging and more.

It also considers the implications for AM of such broader initiatives as the CHIPs Act and other geopolitical actions and trends. 

The Excel accompaniment details semiconductor markets various AM technologies including powder bed fusion, directed energy deposition, metal binder jetting, and bound metal deposition. 

The market study is packaged as a Market Opportunity Brief (MOB) as it provides shorter form, incisive and thorough analysis accompanied by historical market data as well as a 10-year forecast.

Breakouts are also provided by metal, polymer, ceramic and speciality metal powders, as well as by geography.

Specific companies and organisations are mentioned the report including ASML, 3D Systems, Lam Research, Velo3D, Applied Materials, SIMTech, Fabric8Labs, Intel, Coherent, and Nikon Advanced Manufacturing.

This AM Research report is authored by macro analyst for AM Research Matt Kremenetsky, whose work emphasizes 3D printing’s incorporation into the supply chains for strategically critical sectors.

The report highlights the $160 million of market activity in 2024 and its potential growth to $1.4 billion in 2032.

For more information on the report, visit:

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