Precision fluid dispensing systems manufacturer Nordson has released a new solder paste formula to improve bond reliability for various electronic cards.
Applications such as radio frequency identification (RFID) tags, dual interface (DI) smart cards, and biometric passports require attaching an antenna electrically connected to a chip.
Manufacturers often use a silver filled epoxy to bond these components; a method which requires a curing process and can affect bond strength if not enough time is allotted for complete curing.
Other process considerations include low storage temperature requirements of minus 32°F (0°C).
Nordson’s SolderPlus paste is faster and easier because there is no curing time required. Also, solder paste can be stored at a higher temperature, requiring less time to thaw.
While a bending test is often used to determine the lifetime of an RFID card, solder paste simulates what can happen when a card is bent in a wallet to determine at what point electrical disconnection happens.
“The test indicates a SolderPlus bond lasts for more than 20,000 cycles of use,” said Philippe Mysson, Nordson EFD’s business development manager.
“That is equivalent to about 10 years in a wallet. Silver filled epoxy bonds last roughly 1,000 cycles or six months.”
In addition, the chemistry of solder paste makes it safer to use when compared to the chemistry of silver filled epoxy, which contains toxic materials.
Solder paste is also much less expensive because it contains no silver.
“We believe each of these factors make our specialised formula of EFD SolderPlus dispense paste a more reliable, cost-effective alternative to other methods used in RFID bonding applications,” Mysson said.
“The reliability of solder joints is 20 times better than existing standard connections.
“When paired with faster production time, this allows DI smart card and RFID tag manufacturers to improve the quality and reliability of their product while meeting increasing consumer demand.”