Solution to improve bond reliability in RFID tags


Nordson EFD has announced a new SolderPlus dispensing paste formula to improve bond reliability in RFID (Radio Frequency Identification) tags, dual interface (DI) smart cards, and biometric passports.

These applications require attaching an antenna electrically connected to a chip. Manufacturers often use a silver filled epoxy to bond these components. This method requires a curing process, which can affect bond strength if not enough time is allotted for complete curing. Other process considerations include low storage temperature requirements of minus 0° C.

The process of applying Nordson EFD solder paste is faster and easier because there is no curing time required, according to the company. Solder paste can also be stored at a higher temperature, requiring less time to thaw.

A bending test is often used to determine the lifetime of an RFID card. It simulates what can happen when a card is bent in a wallet to determine at what point electrical disconnection happens.

The test indicates a SolderPlus bond lasts for more than 20,000 cycles of use, which is equivalent to approximately 10 years in a wallet. Silver filled epoxy bonds last roughly 1000 cycles or six months.

In addition, the chemistry of solder paste makes it safer to use when compared to the chemistry of silver filled epoxy, which contains toxic materials. Solder paste is also much less expensive because it contains no silver.

The reliability of solder joints is 20 times better than existing standard connections, according to Nordson. When paired with faster production time, this allows DI smart card and RFID tag manufacturers to improve the quality and reliability of their product while meeting increasing consumer demand.